Etching

Etcher - Inductively Coupled Plasma Reactive Ion (ICP-RIE) - Trion Technology Oracle III

The Trion Technology Oracle III  dry plasma etcher (ICP/RIE) is designed for semiconductor and microelectronic devices or substrates.

Features

• Two process chambers each with a variable valved turbo pump
• Central Vacuum Transport (CVT) load lock for fast processing
• Manual load-lock allows manual loading of a single wafer
• Touch screen operator interface

Location

Electrical Engineering Cleanroom
Davis Hall, Suite 114
ÃÍÁÏÊÓƵ North Campus
Buffalo, NY 14260

Fees

  • Internal Academic: $25
  • External Academic: $25
  • Industry: $100
Learn more about our rates
Zoom image: Etcher - Inductively Coupled Plasma Reactive Ion (ICP-RIE) - Trion Technology Oracle III Etcher - Inductively Coupled Plasma Reactive Ion (ICP-RIE) - Trion Technology Oracle III

Etcher - Inductively Coupled Plasma Reactive Ion (ICP-RIE) - Trion Technology Oracle III

Standard Operating Procedure: Etcher - ICP-RIE - Trion Technology Oracle III
For general inquiries, contact:

Donald J. Goralski
Director, Shared Instrumentation Laboratories
(716) 645-5151

For technical inquiries, contact:

Jeff Salzmann
Assistant Professor of Research, Cleanroom Manager
(716) 645-2584